Pulsed heated hot bar reflow soldering is soldering robot in which two solder plated parts are pressed together and heated to a temperature adequate to result in the solder to melt and flow, after which the various components are cooled produce a permanent electro-mechanical bond. Pulsed heated soldering is different from traditional soldering since the reflow of solder is accomplished utilizing a heating element called a “thermode” which can be quickly heated and after that cooled down for each connection resulting in strong joints. Pressure is applied throughout the entire cycle leading to precise positioning. It also definitely makes the process suitable for parts which may otherwise disconnect during cool off. Hot bar reflow soldering is another good choice for applications which need multiple connections to become made simultaneously; up to 200 leads or wires could be connected in just one process cycle. Hot bar reflow soldering processes are reproducible, quantifiable, and traceable to quality standards like ISO / NIST. Hot Bar reflow soldering remains safe and secure, highly operator-independent and straightforward to automate.
Heat seal bonding – also referred to as ACF bonding – is the procedure of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils with very fine pitch (<30 micron). The essential characteristics of inline hotbar machine are heating and cooling of the adhesive under pressure.
Heatstaking is a method of joining two or more parts, where at least one is made out of plastic. The bond is made by partially de-forming the plastic part to fix the other. Heatstaking is the most efficient way to bond metal to plastic, and is commonly used in high volume/low cost applications in the automotive, telecom and 16dexgpky industries. The process works by heating the plastic to a temperature above the glass transition temperature via the use of super-heated air or a thermode, and then applying pressure in order to deform it and create the stake. The plastic is then cooled down again – under constant pressure – below the glass transition temperature, ensuring good fixation of the parts. This cooling can be done with compressed air if using a thermode, or with a cold, preformed tool if super-heated air is used.
Amada Miyachi offers a full line of robotic soldering equipment, bonding heads for benchtop use or for integration or automation, thermodes, and both standard and custom systems for reflow soldering, heat seal bonding and heat staking.